Method of manufacturing electronic devices and corresponding electronic device

ABSTRACT

A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.

PRIORITY CLAIM

This application claims the priority benefit of Italian Application forPatent No. 102019000004835, filed on Apr. 1, 2019, the content of whichis hereby incorporated by reference in its entirety to the maximumextent allowable by law.

TECHNICAL FIELD

The description relates to electronic devices.

One or more embodiments may be applied to sensors such as those of aMicro Electro-Mechanical Systems (MEMS) type.

BACKGROUND

Electronic devices including a Micro Electro-Mechanical Systems (MEMS)sensor and an associated “companion” chip such as anApplication-Specific Integrated Circuit (ASIC) are now common in the artwith the MEMS component mounted onto the companion integrated circuit(IC) chip or arranged on a same substrate as the companion IC chip.

Such devices may be packaged in a full-mold package having a thicknessdefined by the substrate and the mold chase.

Reducing the total device package thickness is a desirable goal whichmay be pursued by reducing the substrate thickness and/or reducing thechase thickness by improving process tolerances.

Another option in that direction may involve moving to a Chip ScalePackage (CSP) process. It is noted that a CSP approach may not beapplicable to MEMS and other sensor structures due to specific featuresof the associated Front End (FE) processes.

Exposing the “top” side of the semiconductor (silicon) substrate hasalso been proposed, primarily with the purpose of opening sensing portsin pressure sensors or optical devices, for instance. Exposing the“bottom” side of the substrate has also been proposed in order toimprove thermal dissipation from the package.

It is noted that a limiting factor of such approaches is related to theuse of a substrate, frame and/or mold compound surrounding (embedding,for instance) the device in its entirety.

There is a need in the art to provide a solution which overcomes thedisadvantages outlined in the foregoing.

SUMMARY

One or more embodiments involve arranging side-by-side on a supportsurface (such as a tape, for instance) a sensor component (a MEMScomponent, for instance) and a companion chip (an ASIC, for instance)mounted on an associated substrate. After providing electric couplingbetween the sensor component and the companion chip, a packagingcompound is overmolded on the assembly. The support tape is removed sothat the resulting package exhibits a final thickness essentiallycorresponding to the (sole) thickness of the sensor component.

BRIEF DESCRIPTION OF THE DRAWINGS

One or more embodiments will now be described, by way of example only,with reference to the annexed figures, wherein:

FIGS. 1A to 1E show steps of a method for making an embodiment,

FIGS. 2A to 2E show steps of a method for making an embodiment,

FIGS. 3A and 3B show a possible variant, and

FIGS. 4A and 4B show another possible variant.

DETAILED DESCRIPTION

In the ensuing description, one or more specific details areillustrated, aimed at providing an in-depth understanding of examples ofembodiments of this description. The embodiments may be obtained withoutone or more of the specific details, or with other methods, components,materials, etc. In other cases, known structures, materials, oroperations are not illustrated or described in detail so that certainaspects of embodiments will not be obscured.

Reference to “an embodiment” or “one embodiment” in the framework of thepresent description is intended to indicate that a particularconfiguration, structure, or characteristic described in relation to theembodiment is comprised in at least one embodiment. Hence, phrases suchas “in an embodiment” or “in one embodiment” that may be present in oneor more points of the present description do not necessarily refer toone and the same embodiment. Moreover, particular conformations,structures, or characteristics may be combined in any adequate way inone or more embodiments.

The references used herein are provided merely for convenience and hencedo not define the extent of protection or the scope of the embodiments.

One or more embodiments as exemplified herein facilitate providing afull-mold package for an electronic device suited to be produced byresorting to standard and generally available technologies whilepursuing a reduction of the total thickness of the resulting device.

One or more embodiments may be applied, for instance, to an electronicsdevice 10 comprising:

-   -   at least one first electronic component 12 such as a sensor (a        MEMS sensor being exemplary of such an component), and    -   at least one second electronic component 14 such as associated        “companion” semiconductor integrated circuit chip or die (an        ASIC being exemplary of such a semiconductor IC chip or die)        mounted on a respective substrate 16.

The designation “respective” highlights the fact that, in one or moreembodiments as exemplified herein, the substrate 16 (which may beregarded as akin to a printed circuit board or PCB) is configured tosupport (only) the semiconductor chip 14 and not the sensor component12, so that the thickness of the substrate 16 does not add to thethickness of the sensor 12.

As exemplified herein, the first component 12 will exhibit a front or“top” surface 12 a and a rear or “bottom” surface 12 b with a thicknessof the component 12 identified by the distance between the surfaces 12a, 12 b.

As discussed previously, there is a need to reduce the total thicknessof the device 10 by letting such a thickness be essentially determinedby the thickness of the component 12 (a sensor such as a MEMS, forinstance), possibly with both surfaces or sides of the component 12(namely the front surface 12 a and the back surface 12 b) exposed at thepackage surface.

In one or more embodiments as portrayed in a first exemplary sequence ofprocessing steps in FIGS. 1A to 1E, a (sacrificial) carrier 20 isprovided (FIG. 1A) onto which the component 12 (e.g. a sensor) and acompanion component 14 (e.g. a semiconductor chip) are arrangedside-by-side with the component 14 mounted on the substrate 16. This maybe via bumps 18, as conventional in the art.

FIGS. 1B to 1D are exemplary of processing steps in a manufacturingprocess which can be performed on a plurality of similar structures orassemblies arranged on a tape-like carrier 20, with these structureseventually separated in a “singulation” step as exemplified in FIG. 1Dto provide individual devices 10 (FIG. 1E).

In one or more embodiments, the carrier 20 may include a tape (apolycarbonate tape, for instance) as conventional in manufacturingprocesses of integrated circuits (ICs).

Once the components 12 and 14 (wherein the component 14 is mounted onthe substrate 16) are arranged side-by-side on the carrier 20, withelectrical coupling 22 provided therebetween as desired (again byconventional solutions, such as wire bonding, for instance) a packagemolding compound 24 can be molded onto the previously formed assembly asexemplified in FIG. 1C, that is by leaving exposed the “cap”, namely thefront surface 12 a of the component 12.

An Epoxy Molding Compound (EMC) may be exemplary of the package moldingcompound 24.

FIG. 1D is exemplary of a singulation processing step (performed, inconventional manner, via a singulation tool indicated S) followed byremoval of the carrier 20 (FIG. 1E) leading to both the front side orsurface 12 a and the rear or back side 12 b of the component 12 beingexposed at the surface of the molding material 24.

As a result the package thickness of the device 10 is determined by(that is, essentially the same as) the thickness of the component 12alone (that is the thickness between the surfaces 12 a, 12 b).

Also, while the opposed surfaces 12 a, 12 b of the component 12 areexposed at the package surface, the material of the component 14 (asemiconductor such as silicon, for instance) is embedded and thus“floating” within the package molding compound 24.

Those of skill in the art will easily appreciate that the sequence ofprocessing steps of FIGS. 1A to 1E is merely exemplary andnon-mandatory: for instance, singulation, here exemplified beforeremoval of the carrier 20, may take place after or simultaneously withremoval of the carrier 20.

In FIGS. 2A to 2E parts, components or processing steps like parts,components or processing steps already discussed in connection withFIGS. 1A to 1E are indicated with like reference symbols. Acorresponding detailed description will not be repeated for brevity.

In embodiments as exemplified in FIGS. 2A to 2E electrical coupling ofthe component (semiconductor chip) 14 to the substrate 16 is achievedvia wire-bonding (again indicated 22) in the place of bumps such asbumps 18 in FIGS. 1B to 1E.

Here again, the package thickness of the device 10 is essentiallydetermined by the thickness of the component 12 alone (that is thethickness between the surfaces 12 a, 12 b), with the possible “height”of the wire bond loops 22 having no practical impact on the totalthickness of the device 10 even taking into account the thickness of thecomponent 14 and the substrate (which may be reasonably expected to bethinner than the component 12).

Here again, while the opposed surfaces 12 a, 12 b of the component 12are exposed at the package surface, the material of the component 14 (asemiconductor such as silicon, for instance) is embedded and thus“floating” within the package molding compound 24.

FIGS. 3A and 3B can be regarded as essentially corresponding to FIGS. 1Dand 1E with parts, components or processing steps already discussed inconnection with FIGS. 1A to 1E indicated with like reference symbols. Acorresponding detailed description will not be repeated for brevity.

FIGS. 3A and 3B are exemplary of the possibility (which may apply bothto embodiments as exemplified in FIGS. 1A to 1E and to embodiments asexemplified in FIGS. 2A to 2E) of providing electromagnetic shieldingmaterial 26 onto the top or front surface of the component 10 (includingthe front or top surface 12 a of the component 12).

Such an approach may be advantageous in case the component 12 (a sensorcomponent, for instance) is sensitive to electromagnetic signal.

The shielding material 26 may comprise (in a manner known to those ofskill in the art) electrically-conductive material such as a metal whichcan be applied onto the component 10 after device singulation andpossible dedicated substrate design.

FIGS. 4A and 4B can be regarded again as essentially corresponding toFIGS. 1D and 1E with parts, components or processing steps alreadydiscussed in connection with FIGS. 1A to 1E indicated with likereference symbols. A corresponding detailed description will not berepeated for brevity.

FIG. 4A and 4B are exemplary of the possibility (which may apply both toembodiments as exemplified in FIGS. 1A to 1E and to embodiments asexemplified in FIGS. 2A to 2E) of providing a (very) thin sensor—adifferential pressure sensor, for instance—with pressure ports 120provided at the exposed surfaces (for instance both the front surface 12a and the back surface 12 b) of the sensor component 12.

Also those of skill in the art will appreciated that the stepped outlineof the sides of the device in FIGS. 4A and 4B is indicative of thepossibility, in one or more embodiments, of providing shielding 26 asexemplified in FIGS. 3A and 3B also in arrangements as exemplified inFIGS. 4A and 4B.

One or more embodiments thus make it possible to reduce the thickness ofthe device 10 by letting it be essentially given by the thickness of thefirst component 12 (a MEMS, for instance) without any contribution tothe device thickness given by the substrate 16 for the companioncomponent 14 and/or by the mold chase thickness.

In one or more embodiments as exemplified herein the (total) thicknessof the molded package (see FIGS. 1E, 2E, 3B and 4B, for instance) isdetermined by the thickness of a single component (here, the component12) which, contrary to the component 14, has no associated substrate byavoiding a combination with the substrate and/or mold materialthickness.

Also, one or more embodiments lend themselves (in the case of a smallrouting specifications and/or low signal count, for instance) toimplementations where the substrate (16 in the figures) is provided viaa copper frame.

Also, certain embodiments (this may be the case of non-capped devices)may facilitate using a component 14 provided with a “dummy”die/interposer mounted on top. This may be advantageous in cases wherethe exposed front and/or back sides of the component may facilitate (viasuch a dummy die for instance) a thermal dissipation function and/or athermal sensing function.

In one or more embodiments, electromagnetic interference (EMI) shieldingcan be enhanced by resorting to a shielding (metalized, for instance)backside and/or to conductive dummy dies at one or both of the opposedsurfaces.

A method as exemplified herein may comprise:

-   -   providing a (planar, for instance) support member (for instance,        20),    -   arranging on the support member:    -   a) at least one first electronic component (for instance, 12)        having opposed first (for instance, 12 a) and second (for        instance, 12 b) surfaces, the at least one first electronic        component arranged on the support member with the second surface        towards the support member, wherein the at least one first        electronic component has a thickness between the opposed first        and second surfaces (for instance, between 12 a and 12 b),    -   b) at least one second electronic component (for instance, 14)        mounted on a substrate (for instance, 16), the at least one        second electronic component arranged on the support member with        the substrate having a substrate surface (facing downwards, in        the figures) opposed the at least one second electronic        component and facing towards the support member, wherein the        substrate and the at least one second electronic component        mounted thereon have a joint (that is, cumulative) thickness        which is less than the thickness of the at least one first        electronic component (see, for instance FIGS. 1B thru 1E, FIGS.        2B thru 2E, 3A and 3B, 4A and 4B),    -   molding package molding material (for instance, 24) onto the        support member having arranged thereon the at least one first        electronic component and the at least one second electronic        component mounted on the substrate, wherein the package molding        material encapsulates the at least one second electronic        component leaving exposed (at the surface of the molding        material) the first surface of the at least one first electronic        component (see, for instance, FIGS. 1C, 2C, 3A and 4A), and    -   separating (removing, for instance) the support member to expose        the second surface of the at least one first electronic        component and the substrate surface of the substrate opposed the        at least one second electronic component (see, for instance,        FIGS. 1E, 2E, 3B and 4B).

A method as exemplified herein may comprise:

-   -   a) providing electrically-conductive formations (for instance,        18 or 22) between:    -   the at least one second electronic component and the substrate        (see, for instance, the bumps 18 in FIGS. 1B to 1E or the wires        22 on the right side of the component 14 in FIGS. 2B to 2E),        and/or    -   the at least one first electronic component and the substrate        (see, for instance, the wires 22 on the right side of the        component 12 in FIGS. 1B to 1E and 2B to 2E), and/or    -   the at least one first electronic component and the at least one        second electronic component (see, for instance, the wires 22        between the components 12 and 14 in FIGS. 2B to 2E),    -   b) molding the package molding material onto the support member        having arranged thereon the at least one first electronic        component and the at least one second electronic component        mounted on the substrate, wherein the package molding material        encapsulates said electrically-conductive formations.

A method as exemplified herein may comprise providing electromagneticshielding material (for instance, 26) over at least one (for instance,12 a) of the first and second opposed surfaces of the at least one firstelectronic component. As discussed a “dummy” shield may be provided oneither of both of these surfaces.

In a method as exemplified herein the at least one first electroniccomponent may comprise a pressure sensor with at least one of theopposed first and second surfaces provided with pressure ports (forinstance, 120).

In a method as exemplified herein, the support member may comprises atape.

In a method as exemplified herein:

-   -   the at least one first electronic component may comprise a        sensor, optionally a MEMS, and/or    -   the at least one second electronic component may comprise a        semiconductor integrated circuit chip, optionally an ASIC.

A method as exemplified herein may comprise:

-   -   arranging on the support member a sequence of assemblies,        wherein each assembly may comprise:    -   a) at least one first electronic component having opposed first        and second surfaces, the at least one first electronic component        arranged on the support member with the second surface towards        the support member, wherein the at least one first electronic        component has a thickness between the opposed first and second        surfaces,    -   b) at least one second electronic component mounted on a        substrate, the at least one second electronic component arranged        on the support member with the substrate having a substrate        surface opposed the at least one second electronic component and        facing towards the support member, wherein the substrate and the        at least one second electronic component mounted thereon have a        joint thickness with is less than the thickness of the at least        one first electronic component,    -   molding onto the support member having arranged thereon said        sequence of assemblies, package molding material to encapsulate        the at least one second electronic component in the assemblies        in said sequence of assemblies leaving exposed the first surface        of the at least one electronic component in the assemblies in        said sequence of assemblies,    -   separating the support member to expose the second surface of        the at least one first electronic component and the substrate        surface of the substrate opposed the at least one second        electronic component in the assemblies in said sequence of        assemblies, and    -   singulating (for instance, S) said sequence of assemblies into        individual devices including at least one said first electronic        component and least one said second electronic component coupled        therewith.

A device (for instance, 10) as exemplified herein, may comprise:

-   -   at least one first electronic component having opposed first and        second surfaces, the at least one first electronic component        arranged on the support member with the second surface towards        the support member, wherein the at least one first electronic        component has a thickness between the opposed first and second        surfaces,    -   at least one second electronic component mounted on a substrate,        the at least one second electronic component arranged on the        support member with the substrate having a substrate surface        opposed the at least one second electronic component and facing        towards the support member, wherein the substrate and the at        least one second electronic component mounted thereon have a        joint thickness with is less than the thickness of the at least        one first electronic component, and    -   package molding material encapsulating the at least one second        electronic component leaving exposed the opposed first and        second surfaces of the at least one electronic component and the        substrate surface of the substrate opposed the at least one        second electronic component.

A device as exemplified herein may comprise electrically-conductiveformations between:

-   -   the at least one second electronic component and the substrate,        and/or    -   the at least one first electronic component and the substrate,        and/or    -   the at least one first electronic component and the at least one        second electronic component,

wherein said package molding material may encapsulate saidelectrically-conductive formations.

A device as exemplified herein may comprise electromagnetic shieldingmaterial over at least one of the first and second opposed surfaces ofthe at least one first electronic component.

In a device as exemplified herein the at least one first electroniccomponent may comprise a pressure sensor, with at least one of theopposed first and second surfaces provided with pressure ports.

In a device as exemplified herein:

-   -   the at least one first electronic component (12) may comprise a        sensor, optionally a MEMS, and/or    -   the at least one second electronic component (14) may comprise a        semiconductor chip, optionally an ASIC.

Without prejudice to the underlying principles, the details andembodiments may vary, even significantly, with respect to what has beendescribed by way of example only, without departing from the scope ofprotection.

The claims are an integral part of the technical disclosure ofembodiments as provided herein.

The extent of protection is determined by the annexed claims.

1. A method, comprising: arranging a first electronic component on asupport member, wherein the first electronic component has opposed firstand second surfaces with the second surface facing towards the supportmember, wherein the first electronic component has a first thicknessbetween the opposed first and second surfaces; arranging a secondelectronic component that is mounted to a substrate on said supportmember, wherein the substrate has a substrate surface opposed the secondelectronic component and facing towards the support member, wherein thesubstrate and the second electronic component combined have a secondthickness which is less than the first thickness; molding a packagemolding material onto the support member to encapsulate the secondelectronic component while leaving exposed the first surface of thefirst electronic component; and removing the support member to exposethe second surface of the first electronic component and the substratesurface of the substrate.
 2. The method of claim 1, further comprising,prior to molding, providing electrically-conductive formations betweenthe second electronic component and the substrate, wherein the packagemolding material encapsulates said electrically-conductive formations.3. The method of claim 1, further comprising, prior to molding,providing electrically-conductive formations between the firstelectronic component and the substrate, wherein the package moldingmaterial encapsulates said electrically-conductive formations.
 4. Themethod of claim 1, further comprising, prior to molding, providingelectrically-conductive formations between the first electroniccomponent and the second electronic component, wherein the packagemolding material encapsulates said electrically-conductive formations.5. The method of claim 1, further comprising, after molding, mounting anelectromagnetic shielding material over at least one of the first andsecond opposed surfaces of the first electronic component.
 6. The methodof claim 1, wherein the first electronic component comprises a pressuresensor and wherein a pressure port is provided at one or more of theopposed first and second surfaces.
 7. The method of claim 1, wherein thesupport member comprises a tape.
 8. The method of claim 1, wherein thefirst electronic component comprises a sensor and the second electroniccomponent comprises a semiconductor integrated circuit chip.
 9. Themethod of claim 8, where the sensor is a MEMS sensor and wherein thesemiconductor integrated circuit chip is an ASIC.
 10. A method,comprising: arranging plurality of assemblies on a support member, whereeach assembly comprises: a first electronic component having opposedfirst and second surfaces with the second surface facing towards thesupport member, wherein the first electronic component has a firstthickness between the opposed first and second surfaces; and a secondelectronic component that is mounted to a substrate, wherein thesubstrate has a substrate surface opposed the second electroniccomponent and facing towards the support member, wherein the substrateand the second electronic component combined have a second thicknesswhich is less than the first thickness; molding a package moldingmaterial onto the support member to encapsulate the second electroniccomponents of the plurality of assemblies while leaving exposed thefirst surface of the first electronic components of the plurality ofassemblies; removing the support member to expose the second surface ofthe first electronic component and the substrate surface of thesubstrate; and singulating said plurality of assemblies into individualdevices, wherein each individual device includes the first electroniccomponent and the second electronic component.
 11. The method of claim10, further comprising, prior to molding, providingelectrically-conductive formations for each assembly between the secondelectronic component and the substrate, wherein the package moldingmaterial encapsulates said electrically-conductive formations.
 12. Themethod of claim 10, further comprising, prior to molding, providingelectrically-conductive formations for each assembly between the firstelectronic component and the substrate, wherein the package moldingmaterial encapsulates said electrically-conductive formations.
 13. Themethod of claim 10 further comprising, prior to molding, providingelectrically-conductive formations for each assembly between the firstelectronic component and the second electronic component, wherein thepackage molding material encapsulates said electrically-conductiveformations.
 14. The method of claim 10, further comprising, aftermolding and singulating, mounting an electromagnetic shielding materialover at least one of the first and second opposed surfaces of the firstelectronic component.
 15. The method of claim 10, wherein the firstelectronic component comprises a pressure sensor and wherein a pressureport is provided at one or more of the opposed first and secondsurfaces.
 16. The method of claim 10, wherein the support membercomprises a tape.
 17. The method of claim 16, wherein singulating doesnot cut through the tape and removing is performed after singulating.18. The method of claim 10, wherein the first electronic componentcomprises a sensor and the second electronic component comprises asemiconductor integrated circuit chip.
 19. The method of claim 18, wherethe sensor is a MEMS sensor and wherein the semiconductor integratedcircuit chip is an ASIC.
 20. A device, comprising: a support member; afirst electronic component having opposed first and second surfaces,wherein the first electronic component is arranged on the support memberwith the second surface facing towards the support member, wherein thefirst electronic component has a first thickness between the opposedfirst and second surfaces; a substrate; a second electronic componentmounted on the substrate, wherein the substrate is arranged on thesupport member with a substrate surface opposed the second electroniccomponent facing towards the support member, wherein the substrate andthe second electronic component mounted thereon combined have a secondthickness that is less than the first thickness; and a package moldingmaterial that encapsulates the second electronic component but leavesexposed the opposed first and second surfaces of the first electroniccomponent and the substrate surface of the substrate.
 21. The device ofclaim 20, further comprising electrically-conductive formations betweenthe second electronic component and the substrate, wherein the packagemolding material encapsulates said electrically-conductive formations.22. The device of claim 20, further comprising electrically-conductiveformations between the first electronic component and the substrate,wherein the package molding material encapsulates saidelectrically-conductive formations.
 23. The device of claim 20, furthercomprising electrically-conductive formations between the firstelectronic component and the second electronic component, wherein thepackage molding material encapsulates said electrically-conductiveformations.
 24. The device of claim 20, further comprising anelectromagnetic shield over at least one of the first and second opposedsurfaces of the first electronic component.
 25. The device of claim 20,wherein the first electronic component comprises a pressure sensor, andwherein a pressure port is provided at one or more of the opposed firstand second surfaces.
 26. The device of claim 20, wherein the firstelectronic component comprises a sensor and the second electroniccomponent comprises a semiconductor integrated circuit chip.
 27. Thedevice of claim 26, where the sensor is a MEMS sensor and wherein thesemiconductor integrated circuit chip is an ASIC.